Part No .:
H3LIS100DLTRManufacturer:
STMicroeletronicsDescription:
MEMSRemark:
new originLast Updated:
2026/10/25
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Physical
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| Mount | Surface Mount |
| Number of Pins | 16 |
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Technical
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| Axis | X, Y, Z |
| Bandwidth | 200 Hz |
| Max Operating Temperature | 85 °C |
| Max Supply Voltage | 3.6 V |
| Min Operating Temperature | -40 °C |
| Min Supply Voltage | 2.16 V |
| Output Type | SPI , I2C |
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Compliance
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| Lead Free | Lead Free |
| REACH SVHC | No SVHC |
| RoHS | Compliant |
MEMS motion sensor: low-power high-g 3-axis digital accelerometer The H3LIS100DL is a low-power highperformance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output. The device features ultra-low-power operational modes that allow advanced power saving and smart sleep-to-wakeup functions. The H3LIS100DL has a full scale of ±100 g and is capable of measuring accelerations with output data rates from 0.5 Hz to 400 Hz. The H3LIS100DL is available in a small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
Data sheet Physical Case/Package QFN Mount Surface Mount Number of Pins 24 Technical Axis X, Y, Z Bandwidth 500 Hz Max Operating Temperature 105 °C Max Supply Voltage 3.6 V Min Operating Temperature -40 °C Min Supply Voltage 2.16 V Output Type SPI , I2C Compliance Lead Free Lead Free REACH SVHC No SVHC RoHS Compliant High-performance ultra-low-power 3-axis accelerometer with digital output for industrial applications
Data sheet Physical Case/Package QFN Contact Plating Tin Mount Surface Mount Number of Pins 2400% Technical Axis X, Y, Z Bandwidth 500 Hz Max Operating Temperature 105 °C Min Operating Temperature -40 °C Operating Supply Voltage 3.6 V Output Type SPI , I2C , Digital Compliance RoHS Compliant High-performance motion sensor for automotive applications: ultra-low-power digital output 3-axis accelerometer The AIS3624DQ is available in a small quad flat no-lead (QFN) package (4x4 mm footprint) and is guaranteed to operate over an extended temperature range from -40 °C to +105 °C. This product may be used in a variety of automotive non-safety applications such as: Motion-activated functions Telematic boxes Impact recognition and logging Vibration monitoring and compensation
Data sheet Physical Case/Package LGA Contact Plating Nickel , Gold Number of Pins 14 Technical Axis X, Y, Z Bandwidth 5.3 kHz Interface I2C , SPI Max Operating Temperature 85 °C Max Supply Voltage 3.6 V Max Supply Voltage (DC) 3.6 V Min Operating Temperature -40 °C Min Supply Voltage 1.71 V Min Supply Voltage (DC) 1.71 V Operating Supply Current 2 µA Output Type Digital Sensor Type 3 Axis Dimensions Height 1 mm Length 2.15 mm Width 2.15 mm Compliance Lead Free Lead Free REACH SVHC No SVHC Radiation Hardening No RoHS Compliant MEMS digital output motion sensor: ultra low-power high performance 3-axis “femto” accelerometer Applications ■ Motion activated functions ■ Display orientation ■ Shake control ■ Pedometer ■ Gaming and virtual reality input devices ■ Impact recognition and logging
Data sheet MEMS inertial sensor high performance 3-axis ±2/±6g ultracompact linear accelerometer Physical Case/Package LGA Contact Plating Nickel , Gold Mount Surface Mount Number of Pins 1600% Technical Axis X, Y, Z Bandwidth 2 kHz Max Operating Temperature 85 °C Max Supply Voltage 3.6 V Min Operating Temperature -40 °C Min Supply Voltage 2.4 V Nominal Supply Current 680 µA Output Type Analog Sensitivity 15000 mV/g Dimensions Height 1.33 mm Length 4.15 mm Width 4.15 mm Compliance Lead Free Lead Free Radiation Hardening No RoHS Compliant
Data sheet Physical Case/Package LGA Mount Surface Mount Number of Pins 16 Technical Axis X, Y, Z Bandwidth 500 Hz Interface I2C , SPI Max Operating Temperature 85 °C Max Supply Voltage 3.6 V Min Operating Temperature -40 °C Min Supply Voltage 2.16 V Output Type Digital , SPI , I2C Resolution 16 b Sensor Type 3 Axis Dimensions Depth 3 mm Length 3 mm Compliance Lead Free Lead Free Radiation Hardening No RoHS Compliant MEMS motion sensor: low-power high-g 3-axis digital accelerometer
Data sheet Physical Case/Package PLCC Mount Surface Mount Number of Pins 20 Technical Density 1 Mb Frequency 15 MHz Interface Serial , 2-Wire Max Operating Temperature 85 °C Max Supply Voltage 5.5 V Memory Size 1 Mb Memory Type EEPROM Min Operating Temperature -40 °C Min Supply Voltage 3 V Nominal Supply Current 10 mA Compliance Lead Free Contains Lead Radiation Hardening No RoHS Compliant The AT17LV series FPGA Configuration EEPROMs (Configurators) provide an easyto-use, cost-effective configuration memory for Field Programmable Gate Arrays. The AT17LV series device is packaged in the 8-lead LAP, 8-lead PDIP, 8-lead SOIC, 20- lead PLCC, 20-lead SOIC, 44-lead PLCC and 44-lead TQFP, see Table 1-1. The AT17LV series Configurators uses a simple serial-access procedure to configure one or more FPGA devices. The user can select the polarity of the reset function by programming four EEPROM bytes. These devices also support a write-protection mechanism within its programming mode. The AT17LV series configurators can be programmed with industry-standard programmers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.
Data sheet Physical Case/Package TSSOP Mount Surface Mount Number of Pins 16 Technical Max Dual Supply Voltage 20 V Max Operating Temperature 70 °C Max Power Dissipation 842 mW Max Supply Current 200 µA Max Supply Voltage 36 V Min Dual Supply Voltage 4.5 V Min Operating Temperature 0 °C Min Supply Voltage 4.5 V Nominal Supply Current 5 µA On-State Resistance 10 Ω Operating Supply Voltage 18 V Supply Type Single , Dual Throw Configuration SPST Turn-Off Delay Time 235 ns Turn-On Delay Time 275 ns Compliance Lead Free Lead Free Radiation Hardening No RoHS Compliant Maxim’s MAX312/MAX313/MAX314 analog switches feature low on-resistance (10Ω max) and 1.5Ω on-resistance matching between channels. These switches conduct equally well in either direction. They offer low leakage over temperature (2.5nA at +85°C). Low power consumption and ESD tolerance greater than 2000V per Method 3015.7 are guaranteed. The MAX312/MAX313/MAX314 are quad, singlepole/single-throw (SPST) analog switches. The MAX312 is normally closed (NC), and the MAX313 is normally open (NO). The MAX314 has two NC switches and two NO switches. All three devices operate from a single supply of +4.5V to +30V or from dual supplies of ±4.5V to ±20V. Applications: Test Equipment Communication Systems PBX, PABX Systems Audio Signal Routing Avionics Sample-and-Hold Circuits Data Acquisition Systems
Data sheet Physical Case/Package LGA Mount Surface Mount Number of Pins 16 Technical Axis X, Y, Z Bandwidth 500 Hz Interface I2C , SPI Max Operating Temperature 85 °C Max Supply Voltage 3.6 V Min Operating Temperature -40 °C Min Supply Voltage 2.16 V Output Type Digital , SPI , I2C Resolution 16 b Sensor Type 3 Axis Dimensions Depth 3 mm Length 3 mm Compliance Lead Free Lead Free Radiation Hardening No RoHS Compliant MEMS motion sensor: low-power high-g 3-axis digital accelerometer
Data sheet Physical Case/Package N Number of Pins 16 Weight 0.037172 oz Technical Input Current 6 mA Max Operating Temperature 85 °C Min Operating Temperature -40 °C Operating Supply Current 6 mA Operating Supply Voltage 35 V Output Current 600 µA Dimensions Height 4.57 mm Length 19.3 mm Compliance Lead Free Lead Free Radiation Hardening No RoHS Compliant
Data sheet Physical Mount Surface Mount Number of Pins 5 Technical Max Operating Temperature 85 °C Max Supply Voltage 2.7 V Min Operating Temperature -40 °C Min Supply Voltage 800 mV Number of Channels 1 Number of Inputs 1 Number of Outputs 1 On-State Resistance 15 Ω Operating Supply Current 10 µA Throw Configuration SPST Compliance RoHS Compliant This single analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC1G66 can handle both analog and digital signals. The combined AC and DC signal has to be between VCC and GND for it to be transmitted in either direction. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems
